Bump bonding apparatus and method

ABSTRACT

Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.

This application is a Divisional application of application Ser. No.09/335,779, filed Jun. 18, 1999 now U.S. Pat. No. 6,302,317.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a bump bonding apparatus for forming,by means of a wire bonding technique, bumps for establishing anelectrical connection to an electrode part of an IC chip. Morespecifically, the present invention relates to a bump bonding apparatusand method for forming such bumps on the wafer before being cut into ICchips.

2. Description of Related Art

Demand for smaller and lighter electronic devices has accelerated inrecent years, particularly with respect to portable devices, and thishas significantly increased demand for smaller IC chips for use in theseelectronic devices.

Conventionally, in a bump bonding apparatus, a single wafer is dicedinto a plurality of individual IC chips, and each IC chip is transportedand positioned onto the bonding stage for bonding by ones, to form bumpsat the electrode parts on the IC chip. Such bump bonding apparatuses,however, suffer from numerous technical problems, including: lowproduction efficiency; difficulty in moving and handling the IC chipswith a tray; and difficulty in positioning the IC chips with goodprecision.

Some of these problems can be addressed by forming bumps for individualIC chips before dicing the wafers into individual chips.

As described more fully below, however, forming bumps directly onto theundiced wafer presents a different set of technical difficulties ascompared with handling the individual IC chips, and these problems musttherefore be resolved in practice.

For example, while the wafers supplied to the bump bonding apparatus arestacked on multiple shelves in the wafer carrier, the wafers are loosein the carrier. Therefore, after the wafers are extracted from thecarrier and regulated for their position on the positioning table, thesewafers are moved to the bonding stage. The wafers are circular discshaving a straight orientation flat cut into one edge of the wafer. Onthe positioning table, it is necessary to regulate a center of the waferin position and regulate the circumferential location of the orientationflat. This requires a complex mechanism, such as a turntable and meansfor positioning the wafer from four directions around the wafercircumference. Positioning is also time consuming. Because the wafersare loose in the carrier, there is also the further danger of carriervibration causing a wafer to fall out from its storage location.

When bumps are formed at various points around the entire surface of thestationary wafer with a large area, the relative movement distance ofthe bonding head and bonding stage becomes rather long. Therefore, alonger arm is required for the bonding mechanism. This makes itmechanically difficult to assure sufficient positioning precision. Theseproblems can be addressed by dividing the wafer circumferentially into aplurality of segments for bump formation, turning the wafer about itscenter when all bumps in one segment are formed, positioning the nextsegment for bump formation, and then forming the bumps in that segment.

In such a case, if the bonding stage, on which the wafer is fixed, isturned, it heats up the stage. Thus, thermal expansion and contractionof the turn drive mechanism makes consistent, high precision positioningdifficult. This heat problem can be addressed in part by blowing a turnair flow to the bottom of the wafer to float and turn the wafer, andstopping the turn of the wafer based either on a timer or visualinspection by an operator. A problem with this method, however, is thatminute variations in the turning air flow cause the wafer to moveirregularly, easily producing variations in rotational positioning.Therefore, consistent, stable wafer positioning is difficult with themethod.

Through extensive research focused on the various technical problemspresented by directly forming bumps on an IC wafer before wafer dicing,the inventors of the present invention proposed, in Japanese Patentapplication No. 3-323064, a bump bonding apparatus and bump formingmethod that effectively resolves the above-noted problems.

However, while the above-noted bump bonding apparatus and bump formingmethod effectively solves the conventional problems described above,there remain a number of technical problems to be solved in order to yetfurther improve productivity, reduce cost, and improve quality.

With a conventional bump bonding apparatus, for example, the wafers arestored and supplied to the bump bonding apparatus in a stack on aplurality of shelves formed in the carrier. To make positioning thewafers on the bonding stage easier, a position regulating means isprovided on the extractor for extracting the wafers from the carrier. Afour-points chuck holds the wafer at four points after regulating theorientation flat to be oriented in a specific direction using theposition regulating means, and moves the wafer to the bonding stage.Inserting the wafers in the carrier is a manual task performed by theoperator. The operator must carefully insert each wafer in the carrierwith the orientation flat oriented in a specific direction, so that thelater positioning operation can proceed smoothly.

This means that the operator may need to repeatedly handle a wafer inorder to position the orientation flat properly. In addition to makingthe operator work greater, this also increases the potential for damageto high cost wafers. Further, in such a case, the wafer is regulated forits position before being transported to the bonding stage. This alsoincreases the number of times for wafer handling, and thus increases thepotential for wafer damage.

Also further, when the chuck holds the wafer at several points aroundthe edge of the wafer for transport, it is also possible for one of thechucking points to be on the orientation flat of the wafer. If the chuckholds the wafer at only a few points, such as four points in the case ofa 4-chucking points type chuck, the wafer may not be properly centeredin the chuck. This means that despite efforts to regulate the wafer forits position, the orientation flat may become out of position, while thewafer is transported onto the bonding stage.

A sensor provided on the bonding stage is also used to detect theposition of the orientation flat on the boding stage in a conventionalbump bonding apparatus. The bonding stage typically reaches temperaturesof approximately 300 degrees centigrade. Therefore, expensive heatresistant sensors capable of withstanding such temperatures must be usedfor the orientation flat sensor, and this contributes to higher cost.

A conventional bump bonding apparatus also typically has an orientationflat sensor located on only one side of the bonding stage. This makeswafer positioning difficult when the wafer is divided circumferentiallyinto plural segments for bump formation, and the wafer is sequentiallyturned about its center to form bumps in one section at a time. The airblowing means that is used for pushing the wafer to one side is alsoprovided only in one direction, on which the orientation flat sensor ismounted. Furthermore, while only one orientation flat sensor isprovided, a plurality of sensors is preferably provided along the baseline of the orientation flat (the cut edge on the outside edge of thewafer) to improve the precision for detecting the orientation flat.

As also noted above, in a conventional apparatus, the method isproposed, wherein the wafer is divided circumferentially into aplurality of segments and is turned about its center to sequentiallyform bumps in each segment, and an air blowing means for floating andturning is therefore used. In this case, however, since the wafer hasbeen heated on the bonding stage and is also cooled down by the air flowfor floating, turning, or, pushing it to one side, the resulting rapidtemperature change may adversely affect the wafer.

Yet further, when the wafer is floated on air for a turn above thebonding stage, consistently stable wafer turning is needed in order toincrease orientation flat detection precision. Depending upon suchfactors as the wafer material and shape, however, stabilizing waferturning under specific conditions can be difficult with conventionaltechnology. For example, when the surface roughness on the back side ofthe wafer exceeds a particular level, such as with quartz and lithiumtantalate wafers, the friction coefficient of the back side of the waferto the bonding stage surface is high and the wafer does not slideeasily. This makes it necessary to use a relatively strong air flow, butwhen the air flow is increased, air flow turbulence is increased. Thus,this makes it even more difficult to stabilize the wafer turning. Arelatively strong air flow is also needed to start turning a heavy orlarge wafer. Increasing the air flow, however, also increases the effectof wafer inertia. This reduces the precision for stopping the wafer atthe end of its turn, and thus leads to orientation flat detection error.

With consideration for the aforementioned problems of the related art,an object of the present invention is therefore to provide a bumpbonding apparatus and bump formation method achieving a further increasein productivity, a reduction in cost, and an increase in quality whenforming electrode bumps directly on a wafer before dicing it.

SUMMARY OF THE INVENTION

To achieve the above object, a first aspect of the present inventionrelates to a bump bonding apparatus for forming bumps by means of abonding head on a wafer that has been transported onto a bonding stageusing a wafer transporting means. In this case, a wafer has beenpreviously regulated for its position so that an orientation flat formedat a circumferential edge of the wafer is oriented in a specificdirection. The transporting portion of this bump bonding apparatuscomprises an orientation flat detecting means for detecting the locationof the orientation flat of the wafer on the bonding stage.

By thus providing the orientation flat detecting means on thetransporting portion, the sensor is not subject to the high temperatureheat of the bonding stage, which is different from the related art inwhich the sensor is provided on the bonding stage. It is therefore notnecessary to use a particularly high temperature resistant sensor.Furthermore, since the orientation flat detecting means can move inconjunction with movement of the transporting portion, the location oforientation flat detection is not limited to one side of the bondingstage, which is different from the related art in which the sensor isfixed at one side of the bonding stage.

The orientation flat detecting means is preferably an optical sensorhaving a light emitting element and a receptor element, and is providedon a chucking means of the transporting portion. By using an opticalsensor, the position of the orientation flat can be more reliablydetected. In addition, by providing the sensor on the chucking means ofthe wafer transporting portion, the orientation flat can be detectedfrom above the wafer, or more specifically from above the bonding stage,thereby more reliably avoiding the effects of heat from the bondingstage.

Yet further preferably, there is a plurality of the detecting meansarranged in a direction perpendicular to the travel direction of thetransporting portion. By thus arranging a plurality of the detectingmeans perpendicularly to the direction of the transporting means travel,orientation flat detection with even greater precision can be achieved.

Yet further preferably, a bevel with a specific slope is formed in thetop surface of the bonding stage at and near the edge of the bondingstage. By thus forming appropriately sloped bevels on the bonding stage,when detecting an orientation flat from above the wafer, a detectionlight emitted from the detecting means is reflected at the bevel indifferent directions from that of incidence when the orientation flat isdesirably positioned directly below the sensor. More specifically, whenthe orientation flat is positioned directly below the sensor, thedetection beam will not be reflected from the top of the bonding stageback to the receptor, and will thus not interfere with orientation flatdetection.

Yet further preferably, a pair of positioning rollers is provided onboth right and left sides of the bonding stage. A floating air blowerfor floating a wafer, a turning air blower for turning a wafer, a firstpositioning air outlet for pushing a turning wafer to a pair of thepositioning rollers on one side and stopping its turn, and a secondpositioning air outlet for pushing a turning wafer to a pair of thepositioning rollers on the other side, are provided on the top surfaceof the bonding stage. A switching means is also provided for switchingthe air supply to the first and second regulating air outlets. It istherefore possible to push the wafer to either side of the bondingstage. In this case, since the orientation flat sensor can also move inconjunction with the transporting means, detecting the orientation flatis not limited to only one side of the bonding stage, and theorientation flat can be detected at either side of it.

A bump bonding apparatus according to a second aspect of the presentinvention forms bumps by means of a bonding head on a wafer supplied toa bonding stage. The apparatus has a pair of positioning rollersdisposed on both right and left sides of the bonding stage and has, onthe top surface of the bonding stage, a floating air blower for floatinga wafer and a turning air blower for turning a wafer, and a positioningair outlet for pushing a turning wafer to a pair of the positioningrollers on at least one side and stopping its turn. The bonding stagecomprises a stage plate in which the air outlets are disposed, a heatblock disposed below the stage plate, and an air chamber provided in thestage plate. The air chamber leads to each of the air outlets and cantemporarily store supply air from outside.

The air chamber in this bump bonding apparatus allows the supply airfrom outside to warm a certain degree in the air chamber before it isejected from the air outlets to the bottom of the wafer. Thus, when airis blown from the air outlets against the bottom of the wafer to float,turn, or position a wafer heated on the bonding stage, the temperaturegradient of ejected-air cooling of the heated wafer is more gradual thanwith a conventional bump bonding apparatus. Thus, the effects of wafercooling by these ejected-air streams can be effectively avoided.

A bump bonding apparatus according to a third aspect of the presentinvention forms bumps by means of a bonding head on a wafer supplied toa bonding stage. This apparatus has on the top surface of the bondingstage a floating air blower for floating a wafer and a turning airblower for turning a wafer, and the air flow from the turning air bloweragainst a back side of the wafer during wafer turn is variable.

By thus varying the air flow against the backside of the wafer duringwafer turn, the air flow can be adjusted according to the wafermaterial, shape, and size. The air flow can thus be controlled toachieve stable wafer turn.

Yet further preferably, the turning air blower comprises: a plurality ofturning air outlets disposed in the substantial same circumference onthe top of the bonding stage; an air supply path of which one end leadsto the turning air outlets, and the other end branches; a normal turningair supplying means disposed at one branch of the air supply path; andan auxiliary turning air supplying means disposed at another branch ofthe air supply path and operable in addition to the normal turning airsupplying means. Additionally, the air flow to the back side of a waferfrom the turning air blower can be changed by controlling the airsupplying means to supply air at a specific flow rate. Therefore, it ispossible to control the air flow to a specific level at the airsupplying means disposed on the opposite end of the air supply path fromthe plurality of turning air outlets. Thereby, the air flow to the backside of the wafer from the turning air outlets is varied. Air supply canthus be adjusted according to the wafer material, size, and shape toachieve stable wafer turn. It is also possible to smoothly slow waferturn from high speed to low speed without completely interrupting theair supply because air supplied from both supplying means is ejectedfrom the same air outlets.

Alternatively, the turning air blower comprises: a plurality of turningair outlets disposed on a first circumference on the top of the bondingstage; an auxiliary turning air outlet disposed on a secondcircumference on the top of the bonding stage; a normal turning airsupplying means disposed at the other end of an air supply path of whicha first end leads to turning air outlets; and an auxiliary turning airsupplying means disposed at the other end of an air supply path of whicha first end leads to auxiliary turning air outlets, and which isoperable in addition to the normal turning air supplying means. In thiscase, the air flow to the back side of a wafer from the turning airblower can be changed by controlling the air supplying means to supplyair at a specific flow rate. Therefore, it is possible to control theair flow to a specific level at the air supplying means disposed on theopposite end of the air supply path from the plurality of turning airoutlets, and thereby vary the air flow to the back side of the waferfrom the turning air outlets. Air supply can thus be adjusted accordingto the wafer material, size, and shape to achieve stable wafer turn.

Yet further preferably, air flow is controllable in the normal turningair blower and/or the auxiliary turning air blower. This enables evenmore precise control of the air flow from the air outlets, enables airflow to be smoothly changed, and can thus further stabilize wafer turn.

Yet further preferably, the air flow to the backside of the wafer duringwafer turn is controllable by supplying air in steps from the auxiliaryturning air blower. By thus enabling air flow from the auxiliary turningair blower to be increased in steps at the start of turning, air flowfrom the air outlets can be smoothly changed, wafer turn can begradually started, and wafer slipping due to rapid starting can beprevented. Further, the air flow to the backside of the wafer duringwafer turn is controllable by intermittently supplying air from theauxiliary turning air blower. By thus intermittently supplying auxiliaryair during wafer turn, low speed, stable wafer turn can be maintainedeven with wafers having a surface roughness on the back side exceeding aparticular level that tends to cause the wafer to stop easily on thebonding stage.

Yet further preferably, the air outlets of the turning air blower aredisposed on top of the bonding stage on a circumference at or near thewafer edge, or a circumference thereinside. In this case, air forturning the wafer is ejected from the bonding stage, therebydistributing torque across the backside of the wafer and enabling stablewafer turn. This is particularly effective with large wafers.

There is yet further preferably an orientation flat detecting means fordetecting the position of a wafer orientation flat on the bonding stage.It is thus possible to detect the position of the orientation flat afterthe wafer is turned on the bonding stage, and thereby confirm theorientation of the wafer on the bonding stage.

A bump bonding apparatus according to a fourth aspect of the presentinvention forms bumps by means of a bonding head on a wafer, which hasbeen previously regulated for its position so that an orientation flatformed at a circumferential edge of the wafer is oriented in a specificdirection, and has been transported onto a bonding stage by atransporting portion. The transporting portion comprises a chuckingmeans for holding a wafer at six points.

With the 6-points chucking means of the present invention, the waferwill not be shifted off-center even if the chuck holds the wafer withone of the chucking points being on the orientation flat. Thus, offsetpositioning of the orientation flat can be effectively prevented when awafer is transported onto the bonding stage, which is different from a4-points chucking means.

A bump bonding apparatus according to a fifth aspect of the presentinvention has a loading station having a carrier for storing a pluralityof wafers stacked therein with a specific gap therebetween, and a lifterfor positioning the carrier at a specific vertical position. Thisapparatus forms bumps by means of a bonding head on a wafer extractedfrom the carrier by an extracting means and placed on a bonding stage bymeans of a transporting means. It further comprises at the loadingstation: a detecting means for detecting whether an orientation flat ofa wafer in the carrier is within a specific range for a referenceposition, and means for notifying the operator when the detecting meansdetects the orientation flat to not be within this specific range forthe reference position.

The orientation flat detecting means can thus reliably detect whetherthe wafer is desirably positioned, and the operator can be notified ofthe result. The operator's task of inserting wafers into the carrier isthus made easier, the job of adjusting the position of the orientationflat can be simplified, and the need for manually handling the waferscan be reduced. It is to be noted that the orientation flat detectingmeans is preferably located at the lifter of the loading station.

Yet further preferably the orientation flat detecting means is aplurality of optical sensors having a light emitting element and areceptor element disposed perpendicularly to the direction of waferextraction from the carrier. Using optical sensors for the orientationflat detecting means thus assures reliable orientation flat detection,while also simplifying both the detecting means and its mountingstructure. Providing a plurality of sensors as described above alsoenables even higher detection precision.

A bump bonding method according to a sixth aspect of the presentinvention forms bumps on a wafer supplied to a bonding stage by means ofa bonding head. A floating air blower for floating a wafer and a turningair blower for turning a wafer are provided on the bonding stage, andthe method comprises a step for variably controlling air flow from theturning air blower to a back side of the wafer during wafer turn.

It is therefore possible to vary the air flow to the back side of thewafer during wafer turn, and thus adjust the air supply according to thewafer material, size, and shape to achieve stable wafer turn.

Yet further preferably, in step for variably controlling air flow fromthe turning air blower during wafer turn, air from the turning airblower is supplied by stages. By thus increasing turning air flow bystages at the start of the turning, air flow from the air outlets can besmoothly changed, wafer turn can be gradually started, and waferslipping due to rapid starting can be prevented.

Further alternatively, the air flow to the backside of the wafer duringwafer turn can be intermittently supplied from the auxiliary turning airblower. By thus intermittently supplying air during wafer turn, lowspeed, stable wafer turn can be maintained even with wafers having asurface roughness on the back side exceeding a particular level thattends to cause the wafer to stop easily on the bonding stage.

Yet further preferably, an orientation flat detecting means is providedfor detecting the position of the orientation flat of a wafer on thebonding stage after wafer turn. In this case, the position of theorientation flat can be detected after wafer turn to confirm theorientation of the wafer on the bonding stage.

Other objects and attainments together with a fuller understanding ofthe invention will become apparent and appreciated by referring to thefollowing description and claims taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing the overall configuration of a bumpbonding apparatus according to a preferred embodiment of the presentinvention;

FIG. 2 is a perspective view of a wire feeding mechanism at the bondinghead of a bump bonding apparatus as shown in FIG. 1;

FIG. 3 is a perspective view of the bonding head with the wire feedingmechanism omitted;

FIG. 4A to FIG. 4C illustrate the bonding process of the bump bondingapparatus as shown in FIG. 1, FIG. 4A being a section view of ballformation process, FIG. 4B being a section view of the process in whichthe ball is bonded to an electrode, and FIG. 4C being a section view ofthe process of cutting the wire and forming the bump;

FIG. 5A to FIG. 5C show a carrier for wafer transportation in a bumpbonding apparatus as shown in FIG. 1, FIG. 5A being a plan view insection through line A—A in FIG. 5B, and FIG. 5B being a front view, andFIG. 5C being a bottom view;

FIG. 6 is a perspective view showing the major components of a lifterdisposed at a loading station in a bump bonding apparatus as shown inFIG. 1;

FIG. 7 is a plan view of the lifter in FIG. 6;

FIG. 8A to FIG. 8D illustrate the orientation flat detection operationof the detecting means on the lifter, FIG. 8A showing the wafer with acurved edge thereof covering one detecting means, FIG. 8B showing thewafer with a curved edge thereof covering both detecting means, FIG. 8Cshowing the wafer with the orientation flat thereof covering onedetecting means, and FIG. 8D showing the wafer stored with theorientation flat parallel to a line between the detecting means;

FIG. 9 is a perspective view showing the major components of a lifterdisposed at an unloading station in a bump bonding apparatus as shown inFIG. 1;

FIG. 10 is a perspective view showing the typical components of anextracting means and an insertion means in a bump bonding apparatus asshown in FIG. 1;

FIG. 11 is a perspective view showing the transporting portion of a bumpbonding apparatus as shown in FIG. 1;

FIG. 12 is a plan view of a chuck in the transporting portion shown inFIG. 11;

FIG. 13 is a side view of the holding part of the chuck shown in FIG.12;

FIG. 14 is a side view of the detecting means of the chuck shown in FIG.12;

FIG. 15 is a perspective view of the bonding stage in a bump bondingapparatus as shown in FIG. 1;

FIG. 16 is a plan view of the bonding stage shown in FIG. 15;

FIG. 17 is a section view of the bonding stage shown in FIG. 15;

FIG. 18 is a descriptive view of the detecting means of the chuckpositioned at an edge of the bonding stage shown in FIG. 15;

FIG. 19A to FIG. 19C are descriptive views of the reflection of anoptical detection beam reflected from various slopes at and near theedge of the bonding stage shown in FIG. 15, FIG. 19A showing a slope of30 degrees to a vertical plane, FIG. 19B showing a slope of 45 degreesto a vertical plane, and FIG. 19B showing a slope of 60 degrees to avertical plane;

FIG. 20 is a first flow chart of the bump bonding process for bondingbumps on each IC chip on a wafer according to a bump bonding apparatus;

FIG. 21 is a second flow chart of the bump bonding process shown in FIG.20;

FIG. 22 is a third flow chart of the bump bonding process shown in FIG.20;

FIG. 23 is a fourth flow chart of the bump bonding process shown in FIG.20;

FIG. 24 is a block diagram of an air blower for wafer turn at thebonding stage;

FIG. 25 is a flow chart of the process for supplying air when turning awafer on the bonding stage;

FIG. 26 is a graph showing the change in air flow for the turning airsupply process shown in FIG. 25;

FIG. 27 is a flow chart of an air supply process for supplying air whenturning a wafer on the bonding stage according to another preferredembodiment of the present invention;

FIG. 28 is a graph showing the change in air flow for the air supplyprocess shown in FIG. 27;

FIG. 29 is a flow chart of an air supply process for supplying air whenturning a wafer on the bonding stage according to yet another preferredembodiment of the present invention;

FIG. 30 is a graph showing the change in air flow in the air supplyprocess shown in FIG. 29; and

FIG. 31 is a descriptive view of an air outlet for wafer turn in abonding stage according to an alternative preferred embodiment of thepresent invention.

DETAILED DESCRIPTION OF THE INVENTION

A first preferred embodiment of the present invention is described belowwith reference to the accompanying FIGS. 1 to 23.

Referring to FIG. 1 first, the overall arrangement of a bump bondingapparatus according to this preferred embodiment of the invention isdescribed. This bump bonding apparatus is designed for bonding adisc-shaped wafer 1 having an orientation flat, which is formed bycutting an edge part of the wafer 1 so that the crystal orientation ofthe wafer 1 can be determined by orientating the orientation flat in aspecific direction.

This bump bonding apparatus is further designed for forming bumps on theindividual IC chips in a wafer before the wafer 1 is diced to separatethe individual IC chips. The bump bonding apparatus comprises thefollowing major components to accomplish this: a loading station 2 whichloads a carrier with stored wafers 1, a transporting station 3 on theloading side of a bonding station 4 for regulating the position of awafer 1 extracted from the carrier; the bonding station 4 for formingbumps; a transporting station 5 on the unloading side of the bondingstation 4 for regulating the position of a wafer 1 on which bumps havebeen formed; and an unloading station 6 for inserting wafers 1 on whichbumps have been formed by one at a time to a carrier and conveying it toa subsequent process. An extracting means 7 for extracting a wafer 1from the loading station 2 to the transporting station 3 on the loadingside, and an inserting means 8 for inserting a wafer 1 from thetransporting station 5 on the unloading side into the unloading station6, are further disposed in front of the moving line for wafer 1. Atransporting means 9 for moving a wafer I from the transporting station3 on the loading side to the bonding station 4, and from the bondingstation 4 to the transporting station 5 on the unloading side, isfurther disposed in front of the extracting means 7 and inserting means8.

A bonding stage 10, which is a heatable stage for bonding usingultrasonic thermal fusion, is disposed at the bonding station 4, and abonding head 11 is disposed behind the bonding stage 10. The bondinghead 11 is supported on an X-Y table 12 which can be moved andpositioned as desired by means of an X axis motor 12 a and a Y axismotor 12 b, and thus can move freely along two axes, X and Y.

As shown in FIG. 2, the bonding head 11 comprises a wire tensioner 17and a wire tensioner 21 disposed between a wire reel 13 and bondingassembly 15 which bonds wire 14 to a wafer 1 located on the bondingstage 10. The wire tensioners allow the wire 14 to be supplied from thewire reel 13 smoothly and without resistance to the bonding assembly 15.The wire tensioners 17 and 21 can accomplish this by using air streams16 and 20 SO that the wire 14 is floated on air streams maintaining aspecific tension and supply path. The wire 14 is supplied to the bondingassembly 15 from a wire reel 13 located at a higher position than thebonding assembly 15. Located between the wire reel 13 and damper 18, thefirst wire tensioner 17 directs an air stream 16 to the wire 14 so thatthe wire is lifted in an upward curve and tension is thus applied to thewire 14. Located directly above a wire guide 18 a of the damper 18 inthe bonding assembly 15, the second wire tensioner 21 directs anotherair stream 20 to the wire 14 to push up the wire 14 and apply an upwardtension to it.

As shown in FIG. 2 and FIG. 3, the bonding assembly 15 comprises thedamper 18 for holding the wire 14, a horn 22 having at the tip thereof acapillary 22 a through which passes wire 14, and a discharge torch 23.The horn 22 applies ultrasonic vibration to a ball 14 a formed at thetip of the horn 22 (see FIGS. 4A-4C). A camera 24 for visually checkingthe quality of the bonding operation is located above the bondingassembly 15. Images captured by the camera 24 are displayed on a monitor(not shown in the figures), and a recognition signal is input to a dataprocessing device (not shown in the figures) for data processing. Alsoprovided are an electromagnetic rocking driver 25 for lifting the tip ofthe bonding assembly 15 up and down by rocking the bonding assembly 15about a pivot point not shown in the figures, and an electromagneticdriver 26 for opening and closing the clamper 18.

Referring to FIG. 4, bonding is accomplished by feeding the wire 14through capillary 22 a, and melting the end of the wire by means of aspark current from the discharge torch 23 to form a ball 14 a as shownin FIG. 4A, each time the bonding head 11 moves to a position opposite aspecific electrode 27 on the wafer 1. The position of the wire 14 withrespect to each electrode 27 is controlled with high precision based onvisual recognition by the camera 24. The ball 14 a is bonded to anelectrode 27 on the wafer 1 by means of thermal compression andultrasonic vibration as shown in FIG. 4B. A force of 30 g to 50 g isdesirable at this time. Ultrasonic vibration is preferably applied in ahorizontal direction at amplitude of 0.5 pm and a frequency of 60 to 70kHz (desirably 63.5 kHz). The wire is then cut by lifting the capillary22 a and damper 18 holding the wire 14 up as shown in FIG. 4C, thusforming a bump 28 projecting to a total height of approximately 60 μmincluding the ball 14 a and wire 14 b projecting therefrom approximately30 μm to 40 μm. The To assures that the wire 14 is cut at a specificposition, and the wire 14 is selected to have a high Young's modulus andlow thermal conductivity.

Next, moving, transporting, and positioning the wafer 1 at each of thestations 2 to 6 are described.

Referring to FIG. 5, carriers 30 for loading and unloading the wafers 1are described first. The carriers 30 store a plurality of wafers 1stacked together with an appropriate gap therebetween. The carriers 30are approximately rectangular box-like frames open at both front andbackside, wherein the back is tapered toward the rear so that the wafers1 cannot slip out of the back. A series of shelves 32 (24 rows ofshelves 32) are formed on both sidewalls 31. The edges of each wafer 1are inserted into and held by matching shelves 32. A rib 34 crossingfrom side to side projects from the bottom surface of an H-shaped bottomwall 33, and the front and back corners at both ends of the rib 34 formpositioning parts 35.

A lifter 40A as shown in FIG. 6 and FIG. 7 is disposed at the loadingstation 2. The carrier 30 on the loading side is placed from above ontoan elevator platform 41. A pair of vertical guide shafts 43 are fixed attop and bottom ends to a stationary frame 42. The elevator platform 41is supported by way of slide bearings 44 so that it can be moved freelyup and down on the guide shafts 43 by means of a servo motor (not shownin the figures) mounted on the back side of the stationary frame 42 anda timing belt 46 that can be driven in forward and reverse by the servomotor. Four positioning pins 47 project from the top of the elevatorplatform 41. These positioning pins 47 engage the four positioning parts35 of the carrier 30 on the loading side, thereby positioning thecarrier 30 on the platform 41. A holding lever 48 is forced into ahorizontal position from above by means of a spring 49 against which theholding lever 48 can retract upward, so that the holding lever 48 bearsdownward against the carrier 30 on the elevator platform 41. As theelevator platform 41 travels vertically, the wafers 1 stored in thecarrier 30 are positioned at a specific wafer extraction heightsequentially from the bottommost wafer 1 in the carrier 30. Limitswitches 58 disposed on a front surface of the stationary frame 42detect specific elevator platform 41 positions, that is, an up positionlimit, down position limit, home position, and a safety stop positionwhen the elevator platform 41 moves above or below the up and downposition limits.

If the direction from which the wafers 1 are extracted from the carrier30 is the front, a pair of positioning bars 50 are vertically disposedat the back side of the elevator platform 41. These positioning bars 50contact two points at a back edge of each of the wafers in the carrier30. The lifter 40A further comprises a shutter 51 extending from thestationary frame 42 to prevent the wafers 1 from falling out from thecarrier 30. To accomplish this, the shutter 51 enters the front of thecarrier 30 and lightly contacts orientation flats 1 a of the wafers 1inside the carrier 30. The bottom edge of the shutter 51 is slightlyabove the wafer 1 extraction height so that the shutter 51 does notinterfere with extracting the wafers from the carrier 30. The shutter 51is affixed to a sliding member 53, which is supported at the backside ofthe stationary frame 42 freely slidable in the wafer extractingdirection on a slide guide 52. A spring 54 urges the sliding member 53backward in the wafer extracting direction. Note that this shuttermechanism is adjusted so that there is a small gap of approximately 0.5mm between the orientation flats 1 a and the shutter 51 when the wafers1 are in contact with the positioning bars 50.

The lifter 40A further comprises a detecting means for detecting theorientation of a wafer 1 stored in the carrier 30 based on the positionof the orientation flat 1 a. More specifically, an arm 57 extendingalong the front of the elevator platform 41 is affixed near the top ofthe stationary frame 42, and two sensors 56 (56A and 56B) are disposedon the arm 57 in a direction perpendicular to the direction in which thewafers are extracted from the carrier 30. These sensors 56A and 56Bdetect whether the position of the orientation flat 1 a of a wafer 1 inthe carrier 30 is within a specific range. In this preferred embodimentof the present invention, these sensors 56 are optical sensorscomprising a light emitting element and a detector element.

An operation whereby the sensors 56 detect the positioning of a wafer 1in the carrier 30 is described with reference to FIG. 8A to FIG. 8D.

FIG. 8A shows a wafer 1 positioned with part of the edge arc of thewafer 1 covering one sensor 56A. In this position, the orientation flat1 a of the wafer 1 is not orientated in a wafer extracting direction,and the position of the orientation flat 1 a is therefore detected to beinappropriate for extraction.

FIG. 8B shows a wafer 1 positioned with part of the edge arc of thewafer 1 covering both sensors 56A and 56B. In this position, theorientation flat 1 a of the wafer 1 is orientated in a directionsubstantially diametrically opposed to the wafer extracting direction,and the position of the orientation flat 1 a is therefore detected to beinappropriate.

FIG. 8C shows a wafer 1 positioned with the orientation flat 1 a edge ofthe wafer 1 covering one sensor 56A. In this position, the orientationflat 1 a of the wafer 1 is orientated generally in the wafer extractingdirection, but is at an angle to the line between the sensors 56A and56B. The position of the orientation flat 1 a is therefore detected tobe inappropriate for extraction.

FIG. 8D shows a wafer 1 positioned with the orientation flat 1 a edge ofthe wafer 1 substantially parallel to the line between the sensors 56Aand 56B. In this position, the wafer 1 is correctly stored in thecarrier 30, and is not detected by either sensor 56A or 56B.

When it is determined by this orientation flat detection operation thatthe position of the orientation flat 1 a is not within a predeterminedrange, the operator is notified by means of an audible or visible alarm,such as a warning indicator, and the operator must manually correct thewafer 1 position.

With the detecting means thus described, it is not necessary to manuallyadjust the position of each wafer 1 so that the orientation flat 1 a isorientated in a specific direction when storing the wafers in thecarrier 30 as it is sufficient to adjust the wafer 1 position only whena positioning error is detected. In addition to thus making theoperator's job easier, the detecting means also reduces the need formanually handling the wafers 1.

The lifter 40B at the unloading station 6 is shown in FIG. 9. Thislifter 40B is substantially identical to the lifter 40A at the loadingstation 2. Like parts in lifter 40A and lifter 40B are indicated by thesame reference numerals below, and further description thereof is thusomitted below and only the differences are described.

The positioning bars 50 and sensors 56 on the sliding member 53 are notneeded in this lifter 40B, and are therefore omitted. A carrier sensor59 for detecting the presence of a carrier 30 is additionally provided.In addition, the shutter 51 can be fixed in position in this lifter 40B.

Next, the wafer extracting means 7 and inserting means 8 are describedwith reference to FIG. 10. It is to be noted that the extracting means 7and inserting means 8 are substantially identical, and both aretherefore described using the extracting means 7 by way of example.

In FIG. 10, the bottom part of a moving support member 63 is supportedso that it can move freely both ways, right and left as seen in thefigure, in the wafer extracting direction along a slide guide 61disposed on the back side of a fixed front frame 60. The bottom of themoving support member 63 is further linked to a moving part 62 a of arodless cylinder 62 so that it can be driven and positioned. A base 65 aof a support arm 65 is movably supported in the moving direction of themoving support member 63 by way of a slide guide 64 at the top of themoving support member 63. A wafer receiver 66 with a suction chuck 67for receiving and supporting the bottom of a wafer 1 is provided at theend of the support arm 65 extending towards the elevator platform 41(see FIG. 6). The base 65 a of the support arm 65 is urged by a spring68 in the direction of the elevator platform 41 until it meets a stopper69. A sensor 70 is further provided, which can detect if the waferreceiver 66 strikes an obstruction while moving and moves in resistanceto the spring 68, and thus the operation can be immediately stopped toprevent damage in such case.

To extract a wafer from the carrier 30 by means of this extracting means7, the wafer receiver 66 at the end of the support arm 65 is firstinserted below the lowest wafer 1 in the carrier 30. The elevatorplatform 41 then descends until the wafer 1 is supported on the waferreceiver 66. The wafer 1 is then held on the wafer receiver 66 by meansof suction chuck 67 as it is extracted from the carrier 30 into thetransporting station 3.

To insert a wafer 1 into the carrier 30 at the unloading station 6 afterbumps have been formed on the wafer 1, the wafer 1 is held by thesuction chuck 67 on the wafer receiver 66 of the inserting means 8, andcarried thereon from the transporting station 5 to the unloading station6 for insertion into the carrier 30.

The transporting means 9 is described next with reference to FIG. 11 toFIG. 14.

FIG. 11 is a perspective view of the overall transporting means 9. Acarriage 72 is provided on the moving means 71 that is parallel to themovement line for wafer 1. The carriage 72 can be driven on the movingmeans 71, and move between the transporting station 3 on the loadingside, bonding station 4, and the transporting station 5 on the unloadingside, and can be positioned appropriately. A ball screw 73 spanning therange of travel of the moving means 71 is rotationally driven by a servomotor 74. A nut threaded onto the ball screw 73 is affixed to thecarriage 72. An elevator 75 is attached to the carriage 72 such that theelevator 75 can freely travel vertically. The elevator 75 is pushednormally upward to its top position limit by a spring 75 a, and can bedriven down to a bottom position limit by means of an internal cylinder.A chucking means 76 extends from the top edge of the elevator 75 so thatit is positioned directly above the movement line for wafer 1.

The chucking means 76 comprises a pair of fingers 77A which can beopened and closed to each other by means of a cylinder 76 a, and anotherfinger 77B disposed horizontally between the other fingers 77A. Each ofthe fingers 77A has a pair of chucking pins 78A held vertically by anintervening floating mechanism 79A. The other finger 77B also has a pairof chucking pins 78B held vertically by an intervening floatingmechanism 79B; these chucking pins 78B can be opened and closed to eachother by means of a cylinder (not shown in the figures). A flange 78 a,78 b is disposed at the bottom end of each of the chucking pins 78A, 78Bto prevent the wafer 1 from dropping out.

It will be obvious that this chucking means 76 can be easily adapted foruse with various sizes of wafers 1 by simply adjusting the position ofthe chucking pins 78A and 78B on the fingers 77A and 77B.

Two sensors 85 (85A and 85B) are mounted in a middle part of finger 77Bby way of an intervening bracket 84. These sensors 85 can be of varioustypes, but in this preferred embodiment of the invention they areoptical sensors comprising a light emitting element and a receptorelement, similar to the orientation flat sensors 56 of the loadingstation 2 described above. While described more fully below, the sensors85 on this chucking means 76 are used in this exemplary embodiment fordetecting the orientation flat or turn errors of the wafer 1 on thebonding stage 10. It is to be noted that these sensors 85 can detect theposition of the orientation flat 1 a from above the bonding stage 10,and can thus reliably avoid the effects of heat from the bonding stage10.

When a wafer 1 is transported by the transporting means 9, the chuckingmeans 76 is first opened, that is, the fingers 77A are separated fromeach other and the chucking pins 78B of the finger 77B are separatedfrom each other. At the transporting station 3 or bonding station 4, theelevator 75 is lowered, and the chucking means 76 is then closed to holda wafer 1 at six points around the circumference of the wafer 1 by meansof the six chucking pins 78A and 78B. The elevator 75 is then raised tothe top position limit, and the carriage 72 linked to the moving part 62a of the rodless cylinder 62 (see FIG. 10) is driven by way of themoving means 71. The base 65 a of support arm 65 is fixed movably in thedirection of moving support member 63 movement to the top of the movingsupport member 63 by way of an intervening slide guide 64. The wafer 1can thus be moved and placed in the bonding station 4 or transportingstation 5 by moving the support arm 65 to the bonding station 4 ortransporting station 5, lowering the elevator 75, and opening thechucking means 76.

As noted above, with this 6-point chucking means 76, the wafer centerwill not be shifted off-center even if any of the chucking pins 78A and78B is on the orientation flat 1 a when the wafer 1 is picked up, whichis different from the conventional 4-point chucking means. Offsetpositioning of the orientation flat when a wafer is transported to thebonding stage 10 can thus be effectively prevented.

Referring to FIG. 15 to FIG. 17, the bonding stage 10 is described. Thebonding stage 10 comprises a stage plate 91 and a heat block 92therebelow. On opposite sides of the stage plate 91 top are disposedpositioning roller pairs 93A and 93B, and positioning parts 95A and 95B.Positioning roller pairs 93A and 93B are disposed with sufficientdistance therebetween that a wafer 1 can be fit easily between theroller pairs. Contact rollers 94A and 94B for engaging the orientationflat from both sides of the stage plate 91 are further disposed at thepositioning parts 95A and 95B. The positioning parts 95A and 95B arefurther disposed opposite the positioning roller pairs 93B and 93A onthe respectively opposite sides of the stage plate 91. For example,positioning part 95A pushes the wafer 1 against positioning roller pair93B to regulate wafer 1 for its position. These positioning parts 95Aand 95B are normally forced by a spring 96 in the direction regulatingthe position of the wafer (i.e., toward the wafer). A cylinder (notshown in the figures) disposed on the back side of the stage plate 91 isused to drive the positioning parts 95A and 95B opposite the positioningdirection so as to open the positioning parts 95A and 95B and releasethe wafer 1.

It will also be obvious that the stage plate 91 is sized appropriatelyto the size of the wafer 1 on which bonding bumps are to be formed.

Further disposed on the stage plate 91 are suction and flotation airoutlets 101 for sucking and floating the wafer 1 above the stage plate91; wafer turning air outlets 102 for turning a wafer 1 on the stageplate 91; and first and second positioning air outlets 103A and 103B.The wafer turning air outlets 102 are each disposed at an angle to thestage plate 91 surface such that the air stream from the air outlets isdirected the same circumferential direction of the wafer 1 so as to turnthe wafer 1 on the stage plate 91. The first and second positioning airoutlets 103A and 103B direct an air stream in mutually oppositedirections so as to push a wafer 1 against positioning roller pair 93Aor 93B as the wafer is turned so that the wafer 1 does not waver. Airsupply to the first and second positioning air outlets 103A and 103B iscontrolled with a valve which can be appropriately switched by a devicenot shown in the figures to direct the air stream in one direction only,that is, toward roller pair 93A or 93B.

The wafer turning air outlets 102 are disposed at a positioncorresponding to the edge area of the wafer 1 in order to assurereliable wafer turn. To avoid interfering with the wafer turning airstream from the turning air outlets 102, the first and secondpositioning air outlets 103A and 103B are disposed inside the radius ofthe wafer turning air stream, and the suction and flotation air outlets101 are disposed both inside and outside this radius.

A waste bonding stage 104 with suction holes 104 a for holding a wastebonding chip thereto is provided at an appropriate edge area of thestage plate 91. Wafers in which there is a crack or chip can be held forbonding by means of suction holes 109.

By means of the first and second positioning air outlets 103A and 103B,a wafer 1 being turned on the stage plate 91 can be positioned againsteither positioning roller pair 93A or 93B in this exemplary embodimentof the invention. The orientation flat sensors 85 on the chucking means76 of the transporting means 9 can also move with the transporting means9, and can therefore detect the position of the orientation flat 1 a ateither side of the stage plate 91.

As shown in FIG. 17, air channels 91 a and 92 a are disposed inside thestage plate 91 and heat block 92. Air for floating, turning, andpositioning a wafer 1 is supplied through these air channels 91 a and 92a to the suction and flotation air outlets 101, wafer turning airoutlets 102, or the first and second positioning air outlets 103A and103B as appropriate. An air chamber 92 b linked to each of the airoutlets is also disposed in the heat block 92 for storing air for supplyfrom the outside through the air channels 91 a and 92 a.

By thus storing air supplied from the outside in an air chamber 92 binside the heat block 92, the air is warmed by the time it is ejectedfrom the air outlets against the bottom of the wafer 1. The temperaturegradient of air cooling the wafer 1 as a result of ejected air from theair outlets floating, turning, or positioning a wafer 1 heated on thebonding stage 10 can thus be reduced compared with the related art. Itis therefore also possible to avoid the adverse effects of the coolingaction of this ejected air stream on the wafer 1.

It is to be noted that six cartridge heaters 105 are further insertedparallel to each other in the heat block 92, and three thermocouples106, one for every two cartridge heaters 105, are embedded in the heatblock 92 to form three temperature control channels in the heat block92. These temperature control channels can control temperatures toapproximately 300 degrees centigrade. The heat block 92 is supported ona pair of legs 107 that are also efficient heat radiators.

It will be obvious that by providing a plurality of temperature controlchannels in the heat block 92, the cartridge heaters 105 can beindividually controlled. As a result, the temperature of the heat block92 can be precisely controlled according to the size of the stage plate91, which is selected according to the size of the wafer 1 on whichbumps are to be bonded.

When a wafer 1 is transported onto this bonding stage 10 by thetransporting means 9, the position of the wafer orientation flat 1 a isfirst detected using the two sensors 85 disposed in a middle part of theone finger 77B in the transporting means 9. It should be further notedthat beveled faces having a specific slope are formed in the top of thestage plate 91 at and near the edge of the stage plate 91 in thispreferred embodiment of the invention. As shown in FIG. 18, afterplacing a wafer 1 on the bonding stage 10, the transporting means 9 ispositioned so that the above-noted orientation flat sensors 85 arepositioned directly above slope 91 c formed at the edge of the stageplate 91. Note that the two sensors 85 are disposed in a directionperpendicular to the direction of travel of the transporting means 9.

The detecting operation whereby the position of the orientation flat 1 ais detected using these two sensors 85 from above the wafer 1, that is,from above the bonding stage for various states of the wafer 1, is thesame as the operation whereby the orientation of the wafer is detectedusing the two orientation flat sensors 56 at the loading station 2 asdescribed above with reference to FIG. 8. That is, when a part of thewafer 1 is directly below either of the sensors 85, the light beam fromthe light emitting element of the sensor 85 is reflected in the samedirection as that in which it was incident to the surface of the wafer1, and the orientation flat 1 a can thus be detected as beingincorrectly positioned. When the wafer 1 is extracted from both of thesensors 85, the orientation flat 1 a can be detected as being correctlypositioned. It is to be noted that the light from the light emittingelement is reflected to the outside by slope 91 c.

The angle of slope 91 c from which a light beam from the sensors 85 isreflected can be any angle whereby the reflected light is not incidentupon the reflective object, such as chucking means 76 or other objectsaround it. Reflection of the emitted light beam from slopes 91 c withdifferent angles is described more fully below with reference to 19A to19C.

FIG. 19A shows a slope 91 c with an angle of 30 degrees to the vertical.Light from a sensor 85 is first reflected by this slope 91 a to thesurface of the bonding stage 10, and is reflected to the outside awayfrom the sensor 85 by the bonding stage 10. As a result, the reflectedlight is not incident upon the sensor 85.

FIG. 19B shows a slope 91 c with an angle of 45 degrees to the vertical.Note that there is a further slope 91 d opposite the first slope 91 c.In this case, light from a sensor 85 is first reflected by this slope 91c to the opposite slope 91 d, and is reflected by this second slope 91 dto the outside away from the sensor 85. As a result, the reflected lightis not incident upon the sensor 85.

FIG. 19C shows a slope 91 c with an angle of 60 degrees to the vertical.In this case light from a sensor 85 is directly reflected to the outsideaway from the sensor 85 by this slope 91 d, and as a result is notincident upon the sensor 85.

By thus providing a slope 91 c with a specific angle in the top at andnear the edge of the stage plate 91, the light beam emitted from thesensors 85 for detecting the position of an orientation flat 1 a fromabove the wafer 1 is reflected in different directions when theorientation flat 1 a is desirably positioned and when it is notdesirably positioned. That is, when the orientation flat 1 a of thewafer 1 is not desirably positioned, the detection beam is reflected bythe slope 91 c away from the sensor 85. When the orientation flat 1 a ofthe wafer 1 is desirably positioned, the detection beam is not reflectedby the slope 9 c and is thus reflected in a different direction, i.e.,the detection beam is reflected by the top surface of the bonding stage10 and is thus incident to the sensor 85. There is thus no interferencewith detecting the position of the orientation flat 1 a.

In a bump bonding process using this bonding stage 10, the wafer 1 isfirst moved to the inside of the opposing positioning roller pairs 93Aand 93B by the transporting means 9. The positioning part 95B on theleft side as seen in the figures then operates, causing its contactrollers 94B to engage the orientation flat 1 a and push the wafer 1 tothe right against the opposing positioning roller pair 93A. An airstream is also ejected from the first positioning air outlets 103A atthis time to help keep the wafer 1 engaged with positioning roller pair93B. At this time, the wafer 1 is thus desirably positioned by contactrollers 94B and positioning roller pair 93A. The wafer 1 is then fixedin place by means of suction pressure using suction and flotation airoutlets 101, and bumps are formed on the IC chips in half of the wafer1.

The suction pressure and left-side positioning part 95B holding thewafer 1 on the bonding stage are then released, the wafer 1 is floatedby blowing air out from suction and flotation air outlets 101 againstthe bottom of the wafer 1, a further air stream is blown from the secondpositioning air outlets 103B to engage the wafer 1 with the right-sidepositioning roller pair 93A, and the wafer 1 is turned against thepositioning roller pair 93A by ejecting an air stream at a specific flowrate from the turning air outlets 102. It is to be noted that byengaging the wafer I with the positioning roller pair 93A as it isturned, the wafer 1 can be stably turned in a fixed position without thewafer wavering.

While the wafer 1 is being turned, the transporting means 9 is moved sothat the sensors 85 are directly above the slope 91 c provided aroundthe outside edge on the right side of the stage plate 91. When the wafer1 is turned one half turn and the orientation flat 1 a is positionedopposite the right-side positioning part 95A, the orientation flat 1 awill be detected by the sensors 85 as described above. The air streamsfloating and turning the wafer 1 are then stopped immediately.

It should be noted that by detecting the orientation flat 1 a at twopoints, the position of the orientation flat 1 a can be detected withhigh precision irrespective of the rate at which the wafer 1 is turned.

It is also possible to reliably detect undesirable turning andpositioning of the wafer 1, such as over-turn, by moving the sensors-85to a position at which over-turn of the orientation flat 1 a can bedetected. This is possible because the sensors 85 can move above thebonding stage 10 in conjunction with movement of the transporting means9.

It should be further noted that when this apparatus is used withrelatively small, lightweight wafers, such as a wafer 3 inches indiameter, wafer turn tends to be unstable at the beginning of waferflotation and turn. In this case, detection for orientation flat 1 a ispreferably performed later, that is, after wafer turn is stabilized.

The positioning part 95A on the right side as seen in the figures thenoperates, causing its contact rollers 94A to engage the orientation flat1 a and push the wafer 1 to the left against the opposing positioningroller pair 93B. The wafer 1 is thus desirably positioned by contactrollers 94A and positioning roller pair 93B at this time. The wafer 1 isthen fixed in place by means of suction pressure using suction andflotation air outlets 101, and bumps are formed on the IC chips in thehalf of the wafer 1 that is now closest to the bonding head 11, thuscompleting bump formation to all IC chips on the wafer 1.

By thus effectively dividing the wafer 1 into two halves, forming bumpsat one half, then turning the wafer and forming bumps at the other half,the range of bonding head 11 movement is smaller, the rigidity anddimensional precision of the bonding head 11 can be assured, and thushigh precision bump formation is possible.

The process for bonding bumps to IC chips on a wafer in a bump bondingapparatus according to the present invention is described next belowwith reference to the flow charts in FIG. 20 to FIG. 23.

When the bump bonding apparatus is driven and the system starts, thewafer is first preheated (step #1). The wafer 1 is heated to aboveapproximately 150 degrees centigrade (in some cases to approximately 300degrees centigrade) at the bonding stage 10, and this preheating stepprevents such problems as wafer cracking that can result from suddenrapid heating. Preheating can be accomplished by various methods. Forexample, the wafer 1 can be preheated in a separate preheating station(not shown in the figures) located between where the wafer 1 isextracted from the carrier 30 and the bonding stage 10. Alternatively,the wafer 1 can be preheated in a separate preheating station beforeextracting the wafer 1 from the carrier 30, and then be reinserted tothe carrier 30. The preheating conditions are appropriately setaccording to the heating temperature and conditions of the bonding stage10.

After preheating to a particular temperature, the wafer 1 is transportedonto the bonding stage 10 by the transporting means 9 (step #2). Asdescribed above, the wafer 1 is held and transported by a 6-pointchucking means 76 after being previously positioned in a particulardirection. The wafer 1 is then held on the bonding stage 10 for aspecific period of time to stabilize the wafer temperature (step #3).This corrects any overall distortion, that is, heat-induced warping, ofthe wafer 1 caused by preheating.

The orientation flat of the wafer is then detected for its position(step #4). At this time, the wafer 1 is floated as it is shifted toeither the right or left side (the left side (L) in this exemplaryembodiment) by the appropriate positioning air stream while theorientation flat is oriented.

If it is detected that the position of the orientation flat isacceptable (OK) in step #4, the wafer flotation and positioning airstreams are both turned off, and the wafer 1 is secured on the bondingstage 10 surface by means of suction (step #7).

If it is detected that the position of the orientation flat is notacceptable (NG) in step #4, the wafer 1 is turned by the turn air stream(step #5) and the orientation of the orientation flat is detected againafter wafer turn stops (step #6). This loop of steps #5 and #6 continuesuntil it is determined that the orientation flat is desirably positionedin step #6. When step #6 thus returns OK, the wafer 1 is secured on thebonding stage 10 by means of suction (step #7).

After detecting the orientation flat of the wafer on the bonding stage10, the position of the wafer is regulated. As described above, theleft-side positioning part 95 in this example is driven to engage thecontact rollers 94 thereof with the orientation flat 1 a and push thewafer 1 against the opposing (right-side) positioning roller pair 93,thereby regulating the position of the wafer 1 between the contactrollers 94 and positioning roller pair 93 (step #12). After thuspositioning the wafer 1, as long as the wafer is kept secured onto thesurface of the bonding stage 10 with suction pressure as describedabove, the members for positioning the wafer 1, that is, positioningroller pair 93 and contact rollers 94, are disengaged from the wafer 1(step #14).

It is to be noted that when the surface roughness on the back of thewafer exceeds a particular level, such as with quartz or lithiumtantalate (LiTa) wafers, the coefficient of friction on the back of thewafer against the surface of the bonding stage is high, and the waferdoes not slide easily. This may make it difficult to smoothly positionand secure the wafer. This problem can be overcome by floating the waferon flotation air (step #11) before securing the wafer in position (step#12). To float the wafer reliably, a timer is preferably used to supplythe wafer flotation air stream for a predetermined time. With the waferfloated its position is regulated. After regulating the position of thewafer, the flotation stream is turned off, and the wafer is secured bysuction onto the bonding stage.

After positioning of the wafer is thus completed, bumps are formed atthe electrode part of IC chips on the wafer in a bonding processdescribed next below.

In this bonding process, repeating recognition for IC chip position,each bump is formed (step #21 and #22). After bonding bumps to all ICchips on a first half of the wafer 1 is completed (step #23), the wafer1 is then turned (reversed) by turning the suction off, and turningflotation, positioning, and turn air streams on (step #31). Afterturning the wafer, the position of the orientation flat is detected andthe wafer 1 is again secured in position as described above (steps #32to #35). Note that this operation is identical to that described abovein steps #4 to #7, and the same operations are performed incorresponding steps except that right and left are reversed.

After completing step #35, the position of the wafer 1 is againregulated (steps #36 to #39). Note that this operation is likewiseidentical to that described above in steps #11 to #14, and the sameoperations are performed in corresponding steps except that right andleft are reversed. Then, bump bonding is performed to the remainingsecond half of the wafer (step #21 and #22).

When bump bonding to all IC chips on this second half of the wafer 1 iscompleted, and bump bonding to all IC chips on the wafer is thuscompleted (step #41), the transporting means 9 is again driven (step#42) to transport the wafer 1 from the bonding stage 10 (step #44). Notethat if the surface roughness on the back of the wafer exceeds aparticular level, such as with quartz or lithium tantalate (LiTa)wafers, so that the coefficient of friction on the back of the waferagainst the surface of the bonding stage prevents the wafer from slidingeasily, the wafer is first floated on flotation air (step #43) beforetransporting it from the bonding stage 10.

The wafer 1 is then gradually cooled in an after-cooling process (step#45) maintaining a predetermined maximum temperature gradient to preventthe wafer 1, which has been heated to a high temperature in the bondingstage 10, from cooling too rapidly. This after-cooling process canreliably prevent cracking and other problems resulting from suddencooling of the wafer 1.

It will thus be obvious that bumps are formed to each electrode of everyIC chip on the wafer surface in a bump bonding apparatus according tothe present invention by dividing the wafer 1 effectively intoapproximate halves, forming bumps on the electrode of IC chips on onehalf, and then turning the wafer to form bumps on the electrode part ofIC chips on the other half.

The process of supplying air for turning the wafer in steps #5, #31, and#33 in the above flow charts is described more fully below withreference to the flow charts in FIG. 24 to FIG. 26.

FIG. 24 shows the basic configuration of an air blowing means 120 forwafer turn in an exemplary embodiment of the present invention. Thisturn air blowing means 120 comprises turn air outlets 102, an air supplypath 121, a turn air supplying means 122, a turn auxiliary supplyingmeans 125, and an air source 128.

The turn air outlets 102 are disposed on substantially the samecircumference on the bonding stage 10 so that the air ejected therefromcauses the wafer 1 to turn.

One end of the air supply path 121 is linked to the turn air outlets102; the other end branches to the turn air supplying means 122 and turnauxiliary supplying means 125. The turn auxiliary supplying means 125can be driven in addition to the turn air supplying means 122. The airsource 128 supplies air to both the turn air supplying means 122 and theturn auxiliary supplying means 125.

The turn air supplying means 122 comprises a turn flow rate needle 123for passing air in a predetermined flow rate for turning the wafer 1,and a turn blow valve 124 for opening and closing to control the airsupply from the air source 128 to the turn flow rate needle 123.Similarly to the air supplying means 122, the auxiliary supplying means125 comprises a turn auxiliary flow rate needle 126 for passing air in apredetermined flow rate for turning the wafer 1, and a turn blow valve127 for opening and shutting to control the air supply from the airsource 128 to the turn auxiliary flow rate needle 126. The turn blowvalves 124 and 127 of the air supplying means 122 and 125 can be openedand shut at a desired timing. A flow meter 129 for measuring the totalair flow supplied from the air supply means 122 and 125 is furtherdisposed at the supply channel 121.

The flow rate of the air ejected from the air outlets 102 can becontrolled with a turn air blowing means 120 thus comprised by changingthe open and shut pattern of the turn blow valves 124 and 127 in theturn air supplying means 122 and 125. For example, by opening the turnblow valve 124 in the air supply means 122 and closing the turn blowvalve 127 in the auxiliary supply means 125, an air stream at the flowrate of only the turn flow rate needle 123 will be ejected from the turnair outlets 102.

If the turn blow valve 127 of the auxiliary then opened, the auxiliaryair stream at a flow rate regulated by needle 126 will be added to theair stream in the supply channel 121, and an air stream at the combinedflow rates of both air supply means 122 and 125 will be passed from thewafer turn air outlets 102.

FIG. 25 is a flow chart of the air supply process using a blower 120according to this preferred embodiment of the invention, and FIG. 26 isa graph showing the change in air flow achieved by this process.

To start wafer turn, the turn blow valves 124 and 127 of both air supplymeans 122 and 125 are opened to supply both the primary and auxiliaryair streams to the air outlets 102 with a total air flow Q₁ (see FIG.26) released from the air outlets 102 on the top surface of the bondingstage 10 (step #51). The flow rates of the primary and auxiliary airstreams are preferably 3.3 to 3.4 liters per minute, and 9 liters perminute. This strong air flow is sufficient to smoothly start wafer turneven with large, heavy wafers or quartz, lithium tantalate, or otherwafers with a surface roughness on the back exceeding a specific level(10 to 80 μm). It is to be noted that a timer is used to supply theauxiliary air stream for a specific time T₁ only, typically 0.3 to 0.8second.

After the timer counts to this time t=T₁, the turn blow valve 127 of theauxiliary supply means 125 is closed to turn the auxiliary air streamoff (step #52). Air flow from the air outlets 102 is thus reduced to alevel Q₀ sufficient only to maintain wafer turn. When time t=T₂ thenpasses, the turn blow valve 124 of the primary air supply means 122 isalso closed to stop the flow of air from the turn air outlets 102 (step#53). The wafer 1 thus gradually loses speed and stops on the bondingstage 10.

It is therefore possible with a wafer-turning air blower 120 accordingto this preferred embodiment of the invention to smoothly start waferturn regardless of wafer material, weight, and size by using a powerfulair stream, and then reduce the air flow once the wafer is turning tomaintain stable wafer turn. It is also possible to change the strengthof the air stream on the turning wafer 1 when both primary and auxiliaryair streams are flowing by turning the auxiliary air supply off, andthereby change smoothly from fast wafer turn to slow wafer turn withoutstopping the air supply.

An air supply process for wafer turn according to an alternativeembodiment of the present invention is described next with reference toFIG. 27 and FIG. 28. FIG. 27 is a flow chart of this air supply process,and FIG. 28 is a graph showing the change in air flow achieved by thisprocess. The configuration of the turn air blower used in this airsupply process is identical to that used in the above process and shownin FIG. 24. Further description thereof is thus omitted below.

To start wafer turn, the turn blow valves 124 and 127 of both air supplymeans 122 and 125 are opened to supply both the primary and auxiliaryair streams to the air outlets 102 with a total air flow Q₁ (see FIG.28) released from the air outlets 102 on the top surface of the bondingstage 10 (step #61). This strong air flow is sufficient to smoothlystart wafer turn even with large, heavy wafers or quartz, lithiumtantalate, or other wafers with a surface roughness on the backexceeding a particular level (10 to 80 μm).

After the timer counts to time t=T₁, the turn blow valve 127 of theauxiliary supply means 125 is closed so as to turn the auxiliary airstream off (step #62). Air flow from the air outlets 102 is thus reducedto a level Q₀ sufficient only to maintain wafer turn. This air flow ismaintained for a specific time (T₁ to T₂) (step 463). The turn blowvalve 127 for the auxiliary supply means 125 is then reopened to againsupply the combined total air flow Q₁ from the air supply means 122 and125 to the air outlets 102 (step #64). It is to be noted that to achievean even more stable wafer turn, the air flow set by the needle 126 ofthe auxiliary supply means 125 can be changed to supply air in step #64at a different rate than is supplied in step #61.

After time t=T₃ the turn blow valve 127 of the auxiliary supply means125 is again closed to turn the auxiliary air stream off (step #65),thus reducing the air flow to a level Q₀ sufficient only to maintainwafer turn.

When time t=T₄, the turn blow valve 124 of the primary air supply means122 is also closed to stop the flow of air from the turn air outlets 102(step #66). The wafer 1 thus gradually loses speed and stops on thebonding stage 10.

Low speed wafer turn is preferable as a means of assuring preciseorientation flat detection, but when the surface roughness of the waferback exceeds a particular level, typically 10 to 80 μm, as with theabove-noted quartz and LiTa wafers, the wafer may stop turning before itreaches the orientation flat detection position when the wafer isturning at low speed. With the method according to this alternativeembodiment, however, such wafers can be stably turned at low speed byintermittently supplying the auxiliary air, that is, turning theauxiliary supply means 125 on again while the wafer is turning afteronce turning it off, once wafer turn has started. It should be furthernoted that this intermittent air supply can be repeated a plurality oftimes. For example, large, heavy wafers such as a 12-inch wafer requiresa relatively long time to turn, but the required time can be shortenedby intermittently supplying the auxiliary air a plurality of times.

A further alternative method of controlling the air supply for waferturn according to the present invention is described next with referenceto FIG. 29 and FIG. 30. FIG. 29 is a flow chart of this air supplymethod, and FIG. 30 is a graph showing the change in air flow achievedby this method. The configuration of the turn air blower used in thisair supply method is identical to that used in the above process andshown in FIG. 24. Further description thereof is thus omitted below.

To start wafer turn, the control valves 124 and 127 of both air supplymeans 122 and 125 are opened to supply both the primary and auxiliaryair streams to the air outlets 102 with a total air flow Q₁ (see FIG.30) released from the air outlets 102 on the top surface of the bondingstage 10 (step #71).

At time t=T₁, the air flow controlled by needle 126 is then changed toincrease the auxiliary air supply (step #72). The combined air flow fromthe air outlets 102 at this time is Q₂, where Q₂>Q₁.

At time t=T₂, the air flow controlled by needle 126 is again changed toagain increase the auxiliary air supply (step #73). The combined airflow from the air outlets 102 at this time is Q₃, where Q₃>Q₂.

At time t=T₃, the flow control valve 127 of the auxiliary supply means125 is closed to turn the auxiliary air stream off (step #74). Air flowfrom the air outlets 102 is thus reduced to a level Q₀ sufficient onlyto maintain wafer turn. This air flow is maintained to time t=T₄, atwhich point the flow control valve 124 for the air supply means 122 isclosed to stop supplying air to the turn air outlets 102 (step #75). Thewafer 1 thus gradually loses speed and stops on the bonding stage 10.

By thus gradually increasing the air supply from the auxiliary supplymeans in this alternative embodiment of the present invention togradually increase the total air flow, wafer turn can be startedgradually and the wafer can thus be prevented from accidentally slippingoff the bonding stage.

It is to be noted that while the turn air outlets are disposed around asingle circular path near the periphery of the wafer on the bondingstage 10 as a preferred means of achieving stable wafer turn, it isfurther possible to provide additional turn air outlets inside thisoutside circumference. A bonding stage according to this alternativeembodiment of the invention is shown in FIG. 31.

As will be known from FIG. 31, a stage plate 91 in a bonding stage 10according to this preferred embodiment comprises outside turn airoutlets 102A disposed in an area near the wafer edge, and inside turnair outlets 102B disposed inside of these outside outlets. Air issupplied to these air outlets from an air supply means substantiallyidentical to that described above so that air is ejected evenly fromboth the outside and inside turn air outlets 102A and 102B. Note thatthe positioning roller pairs 93A and 93B are also shown for reference inFIG. 31.

By thus positioning air against the back of the wafer 1 from a widerarea of the stage plate 91, turn force causing the wafer to turn can bedistributed to the entire back surface of the wafer 1 to achieve stablewafer turn. This method is particularly effective with large wafers.

It is also to be noted that while the above exemplary embodiment of theinvention has been described with the blower 120 shown in FIG. 24blowing air from the air supply means 122 and auxiliary supply means 125from the same air outlets 102, the invention shall obviously not be solimited. More specifically, separate air outlets can be provided for theair supply means 122 and the auxiliary supply means 125. For example,air supplied from the turn air supply means 122 can be ejected frominside turn air outlets 102B, while air supplied from the auxiliarysupply means 125 can be ejected from outside turn air outlets 102A. Inthis case a relatively weak supply of air can be used for the auxiliarysupply.

Although the present invention has been described in connection with thepreferred embodiments thereof with reference to the accompanyingdrawings, it is to be noted that various changes and modifications willbe apparent to those skilled in the art. Such changes and modificationsare to be understood as included within the scope of the presentinvention as defined by the appended claims, unless they departtherefrom.

What is claimed is:
 1. A bump bonding apparatus comprising: a bondinghead being operable to form bumps on a wafer having an orientation flaton a circumferential edge thereof before the wafer is diced into aplurality of individual IC chips; a bonding stage being operable tosupport and position the wafer such that said bonding head is operableto form bumps on the wafer, said bonding stage including a floating andturning component being operable to float and turn the wafer on a topsurface of said bonding stage; and a transporting device being operableto transport the wafer to said bonding stage and place the wafer on saidbonding stage in a prearranged orientation, said transporting deviceincluding a chucking component operable to hold the wafer, said chuckingcomponent comprising a first outside-finger and a second outside-fingerarranged in parallel, each of said first and second outside-fingershaving a pair of chucking pins positioned at a specific distance along alongitudinal direction of said first and second outside-fingers,respectively, and extended vertically downward, and said first andsecond outside-fingers being adapted to be driven such that said pairsof chucking pins on said first and second outside-fingers are moveablein a direction towards and away from each other, each chucking pin ofsaid pairs of chucking pins including a flange disposed at a bottom endthereof to prevent the wafer from dropping out, and a middle-fingerpositioned between said first and second outside-fingers in parallelwith each of said first and second outside-fingers, said middle-fingerhaving a pair of chucking pins adapted to be moveable in a directiontowards and away from each other in a longitudinal direction of saidmiddle-finger orthogonal to the moving direction of said pairs ofchucking pins of said first and second outside-fingers, each of saidpair of chucking pins of said middle-finger including a flange disposedat a bottom end thereof to prevent the wafer from dropping out.
 2. Theapparatus of claim 1, wherein said transporting device further includesan orientation flat detection component being operable to detect aposition of the orientation flat of the wafer supported by said bondingstage.